The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2004
Filed:
Feb. 11, 2002
Tony Mule′, Atlanta, GA (US);
Chirag Patel, College Park, GA (US);
James D. Meindl, Marietta, GA (US);
Thomas K. Gaylord, Atlanta, GA (US);
Elias N. Glytsis, Dunwoody, GA (US);
Kevin P. Martin, Atlanta, GA (US);
Stephen M. Schultz, Tucson, AZ (US);
Muhannad Bakir, Atlanta, GA (US);
Hollie Reed, Smyrna, GA (US);
Paul Kohl, Atlanta, GA (US);
Georgia Tech Research Corporation, Atlanta, GA (US);
Abstract
Wafer-level electronic packages having waveguides and methods of fabricating chip-level electronic packages having waveguides are disclosed. A representative chip-level electronic package includes at least one waveguide having a waveguide core. In addition, another representative chip-level electronic package includes a waveguide having an air-gap cladding layer around a portion of the waveguide core. A representative method for fabricating a chip-level electronic package includes: providing a substrate having a passivation layer disposed on the substrate; disposing a waveguide core on a portion of the passivation layer; disposing a first sacrificial layer onto at least one portion of the passivation layer and the waveguide core; disposing an overcoat layer onto the passivation layer and the first sacrificial layer; and removing the first sacrificial layer to define an air-gap cladding layer within the overcoat polymer layer and around a portion of the waveguide core.