The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2004

Filed:

Jan. 06, 2003
Applicant:
Inventors:

James G. Maveety, San Jose, CA (US);

Gregory M. Chrysler, Chandler, AZ (US);

Michael C. Garner, Pleasanton, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract

Apparatus and methods in accordance with the present invention provide self-contained, closed-loop microchannel/electrokinetic pump cooling systems that can be integrated into the microelectronic die and the integrated heat sink to provide microelectronic die cooling. Microchannel/electrokinetic pump cooling systems utilize active cooling technology to reduce thermal gradients and operating temperature of a microelectronic die. This system disclosed here will enhance heat dissipation and provide immediate cooling of localized hot spots within the microelectronic die. This will have the effect of reducing the microelectronic die temperature or spreading the heat internally within the microelectronic die depending on the layout of the microchannels.


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