The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2004
Filed:
Apr. 16, 2003
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
In semiconductor device under this invention, bonding pads are lined up in a staggered pattern on the main surface of semiconductor chip which is mounted on insulated substrate . Multiple stud bumps are stacked on top of the pads which are located on the inner rows, and these stud bumps comprise stud bump stack . Conductive wire connects the lands on the insulated substrate with the corresponding bonding pads . The wire is formed with its beginning at the land and its end at the bonding pad. Via the stud bump stacks , the ends of conductive wire on the inner pads are in a higher position than the ends of conductive wires on the outer pads, so that the problem of neighboring conductive wires coming into contact does not occur.