The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2004
Filed:
Jan. 27, 2003
Nobuyoshi Tsukaguchi, Nagano, JP;
Takayuki Takahashi, Nagano, JP;
Yukihiro Kitamura, Nagano, JP;
Masami Kimura, Chiba, JP;
Dowa Mining Co., Ltd., Tokyo, JP;
Abstract
There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: bonding a metal plate of an alloy containing copper and nickel directly to at least one side of a ceramic substrate ; applying a resist on a predetermined portion of the metal plate to remove an undesired portion of the metal plate by etching; and removing the resist to form a pattern having a predetermined shape of the alloy on the ceramic substrate . According to this method, it is possible to reduce the displacement failure of parts to improve productivity and to prevent bonding failure during the mounting of a semiconductor device or the like thereon.