The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2004
Filed:
Sep. 10, 2002
Sharon Ko Mei Wan, Melaka, MY;
Jaime A. Bayan, Palo Alto, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
Embodiments of the invention include an integrated circuit package and methods for its construction. An integrated circuit package of the invention includes a die attach pad and a plurality of lead pads. An integrated circuit die is mounted with the front side of the die attach pad and electrically connected to the plurality of lead pads. Additionally, the backside of the die attach pad includes a pattern of mesas formed thereon. Each of the mesas is configured such that they have a top surface area that is substantially the same size as the surface area of the lead pads. A contact layer of reflowable material is formed on the top surface of the mesas and the lead pads, forming an integrated circuit package with an improved contact layer.