The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6770980 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 03, 2004

Filed:

Aug. 19, 2002
Applicant:
Inventor:

Jun Shibata, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract

First electrodes disposed on the surface of the substrate comprise a plurality of chip select electrodes, and the first chip select electrode among a plurality of chip select electrodes to in electrically connected only to a semiconductor element. The N-th (N is a integer of 2 or more) chip select electrode is electrically connected only to the second electrode disposed on the back at position corresponding to the (N−1)-th chip select electrode, and the plurality of chip select electrodes are sporadically disposed in the first electrodes.


Find Patent Forward Citations

Shibata, Jun. (2004). Semiconductor device having semiconductor element packaged on interposer (U.S. Patent No. 6770980). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6770980

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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