Apparatus and method for refurbishing polishing pads used in chemical-mechanical planarization of semiconductor wafers

Abstract

An apparatus and method for refurbishing fixed-abrasive polishing pads. In one embodiment, a refurbishing device has an arm positionable over the planarizing surface of the polishing pad, a refurbishing element attached to one end of the arm, and an actuator connected to the other end of the arm. The refurbishing element has a non-abrasive contact medium engageable with the planarizing surface of the polishing pad that does not abrade or otherwise damage raised features on the fixed-abrasive pad under desired conditioning down forces. The actuator moves the arm downwardly and upwardly with respect to the planarizing surface to engage and disengage the non-abrasive contact medium with the planarizing surface of the polishing pad. The refurbishing device may also have a conditioning solution dispenser positionable proximate to the planarizing surface of the polishing pad to dispense a liquid conditioning solution onto the planarizing surface. The conditioning solution is selected from a liquid that reacts or otherwise interacts with the particular waste matter material to allow the non-abrasive contact medium to remove waste matter material from the polishing pad. As the refurbishing element engages the planarizing surface in the presence of the conditioning solution, at least one of the refurbishing element or the polishing pad moves with respect to the other. In operation, the conditioning solution and the refurbishing element remove waste matter from the pad without abrading or otherwise damaging the planarizing surface of the polishing pad.