The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2004
Filed:
Aug. 17, 2001
Applicant:
Inventors:
Assignee:
Nippon Mining and Metals Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 1/508 ; B32B 9/00 ;
U.S. Cl.
CPC ...
B32B 1/508 ; B32B 9/00 ;
Abstract
A copper-alloy foil used for a laminate sheet achieves 5.0N/cm or more of 180° peeling strength when thermally fusion-bonded with liquid crystal polymer. The copper-alloy foil contains one or more of from 0.01 to 2.0% of Cr and from 0.01 to 1.0% of Zr. An oxide layer and occasionally a rust-proof film present on the outermost surface is 10 nm or less. The electrical conductivity is 50% IACS.
Nagai, Hifumi. (2004). Copper-alloy foil to be used for laminate sheet (U.S. Patent No. 6767643). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6767643
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile