The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2004
Filed:
May. 07, 2002
Applicant:
Inventors:
Chi-Fu Yu, Taipei, TW;
Song-Yueha Lin, Yung-Count, TW;
Hom-Chung Lin, Taichung, TW;
Zuo-Chang Yen, Tainan, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd, Hsin Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/100 ; C23C 1/600 ;
U.S. Cl.
CPC ...
H01L 2/100 ; C23C 1/600 ;
Abstract
A substrate holding mechanism which is particularly adaptable to automatically centering a semiconductor wafer on a platen spider as the wafer is lowered from a wafer loading and unloading position to a wafer processing position in a medium current implanter such as a Varian EHP500. Upon subsequent placement of a mechanical clamp on the wafer to hold the wafer on the platen, the clamp fingers of the clamp engage the edge of the wafer with substantially uniform pressure to prevent micro-cracking or fracturing of the wafer.