The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2004
Filed:
Jan. 10, 2002
Applicant:
Inventors:
Jae Soo Park, Singapore, SG;
Chivukula Subramanyam, Singapore, SG;
Thow Phock Chua, Singapore, SG;
Hong Lim Lee, Malaysia, MY;
Assignee:
Chartered Semiconductor Manufacturing Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
An integrated circuit interconnect is provided having a dielectric layer disposed between a wide top metal line and a wide bottom metal line. A via-sea in the dielectric layer connects the wide top and wide bottom metal lines by means of a first via having a width, a second via having a width and spaced more than two widths away and less than four widths away from the first via.