The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2004
Filed:
Oct. 11, 2002
Applicant:
Inventors:
Kuan-Min Lin, Taipei, TW;
Jin-Ji Shen, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Maunfacturing Co., Ltd., Hsin Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/358 ;
U.S. Cl.
CPC ...
H01L 2/358 ;
Abstract
A new and improved bonding pad having separate areas for probe needle contact and wire bonding in semiconductor packaging technology. The bonding pad typically has a generally elongated, rectangular configuration with a wire bonding area at one end and a probe needle contact area at the other end of the pad. At least one notch mark may be provided on or adjacent to the bonding pad between the wire bonding area and the probe needle contact area for demarcating these areas during chip production.