The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 2004
Filed:
Jan. 15, 2002
Hiroshi Okabe, Kokubunji, JP;
Hirozi Yamada, Shiroyama, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
In an electronic circuit equipment using a multilayer circuit board on which a semiconductor chip is mounted, a thin film capacitor is provided on the multilayer circuit board. Moreover, a first electrode of the thin film capacitor and a first wiring of the multilayer circuit board are electrically connected to each other, and a second electrode of the thin film capacitor and a second wiring of the multilayer circuit board are electrically connected to each other, respectively. Furthermore, a thin film dielectric of the thin film capacitor was grown epitaxially with the first electrode as its base. The employment of the multilayer circuit board makes it possible to provide the electronic circuit equipment using the multilayer circuit board that includes the built-in thin film capacitor having the high dielectric-constant thin film dielectric.