The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2004

Filed:

Nov. 12, 2002
Applicant:
Inventors:

Akihito Takano, Nagano, JP;

Akira Fujisawa, Nagano, JP;

Akio Rokugawa, Nagano, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01K 3/10 ; C23C 1/400 ; B05D 5/12 ; H01B 1/300 ;
U.S. Cl.
CPC ...
H01K 3/10 ; C23C 1/400 ; B05D 5/12 ; H01B 1/300 ;
Abstract

A process facilitates manufacturing a multiple layer wiring board having therein a thin-film capacitor The process includes: forming a metallic film layer having a barrier metal layer and a metal layer to be sequentially anode oxidized on an insulating layer first conductor pattern; covering a lower electrode forming region of the thin film capacitor in the first conductor pattern with a first resist film; etching to remove an uncovered portion of the metallic film layer; removing the first resist film and covering the first conductor pattern, except for part of the metallic film layer, with a second resist film; forming an anodic oxidation film on the exposed metallic film layer; removing the second resist film and attaching an adherence layer and a metal seed layer, sequentially, on the anodic oxidation film end on the first conductor pattern; and forming an upper electrode second conductor pattern on the anodic oxidation film.


Find Patent Forward Citations

Loading…