The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6753614 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 22, 2004

Filed:

Mar. 28, 2002
Applicant:
Inventors:

Osamu Yamazaki, Saitama, JP;

Kazuyoshi Gbe, Shiraoka-machi, JP;

Assignee:

Lintec Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract

A semiconductor chip carrying adhesive tape, wherein a plurality of adhesive agent portions for adhering semiconductor chips are intermittently formed on a tape shaped base material in the longitudinal direction of the base material to have a substantially identical shape with that of the semiconductor chip to be adhered or a slightly larger shape than that, and an adhesive agent constituting said adhesive agent portions has gradable adhesiveness, can improve a yield of adhesive agent attached semiconductor chips and prevent a wasteful use of an adhesive agent.


Find Patent Forward Citations

Yamazaki, Osamu. (2004). Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, and semiconductor chip packaging body (U.S. Patent No. 6753614). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6753614

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…