The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2004
Filed:
Aug. 14, 2000
Applicant:
Inventors:
Eiichi Hase, Iruma, JP;
Shun Imai, Komoro, JP;
Assignee:
Renesas Technology Corp., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/334 ;
Abstract
The present invention relates to a high frequency circuit module in which a two or more layer dielectric substrate is used. The dielectric substrate provided between a conductor line of a matching circuit on the input side or on the output side and a metal ground is composed of two or more layers. Since a required part can be increased in thickness without changing the thickness of the whole dielectric substrate, the transmission loss can be reduced and the miniaturization of the high frequency circuit module and the communication device using the same can be realized.