The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 2004

Filed:

Nov. 24, 2000
Applicant:
Inventor:

Katsuo Honda, Mitaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 7/00 ; B24B 9/00 ;
U.S. Cl.
CPC ...
B24B 7/00 ; B24B 9/00 ;
Abstract

In the planarization apparatus, an etching stage is installed in a body where a rough grinding stage and a finishing grinding stage are disposed, and the rough grinding, finishing grinding, and etching of a wafer are performed in the same planarization apparatus. A chuck for holding the wafer is moved in an order through the rough grinding stage, the finishing grinding stage and the etching stage while keeping holding the wafer. When the chuck is positioned at the etching stage, the chuck is moved up toward an etching vessel and the wafer that is held by the chuck is housed in the etching vessel. In this state, etching solution is projected on the wafer from a nozzle and the wafer is etched.


Find Patent Forward Citations

Honda, Katsuo. (2004). Planarization apparatus with grinding and etching devices and holding device for moving workpiece between said devices (U.S. Patent No. 6752701). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6752701

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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