The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2004
Filed:
Aug. 23, 2000
Uwe Gunter Stoeckgen, Dresden, DE;
Gerd Marxsen, Radebeul, DE;
Advanced Micro Devices, Inc., Austin, TX (US);
Abstract
The present invention is directed to a method and apparatus for performing polishing operations on substrates in an integrated circuit manufacturing environment. In one embodiment, the apparatus is comprised of a movable polishing platen, a polishing pad positioned on the platen, and a polishing arm that is adapted to receive and move the substrate relative to the polishing pad. The apparatus further comprises a first pad conditioner with a first conditioning surface that is positionable to allow contact between the first conditioning surface and the polishing pad, and a second pad conditioner with a second conditioning surface that is positionable to allow contact between the second conditioning surface and the polishing pad. In one embodiment, the method of the present invention comprises positioning a substrate to be polished in a polishing tool, supplying a polishing slurry to the tool, and providing relative movement between the substrate and a polishing pad. The method further comprises urging first and second pad conditioners into contact with the polishing pad, and providing a relative movement therebetween.