The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2004
Filed:
Nov. 08, 2002
Applicant:
Inventors:
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/300 ;
U.S. Cl.
CPC ...
B24B 1/300 ;
Abstract
An apparatus ( ) for wafer grinding includes sensors ( ) and a spectral analyzer to perform a spectral analysis of light received by the sensors ( ) during grinding of a semiconductor wafer ( ). Based on the spectral analysis, the grinding process is stopped or the force applied to the semiconductor wafer is modified. This in situ monitoring decreases breakage and overheating of the semiconductor wafer ( ).