The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2004
Filed:
Nov. 28, 2001
Applicant:
Inventors:
Yam Mo Wong, Singapore, SG;
Keng Yew Song, Singapore, SG;
Ka Shing Kwan, Singapore, SG;
Hon Yu Ng, Singapore, SG;
Tin Kwan Chan, Singapore, SG;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/700 ; B23K 3/100 ; B23K 3/102 ;
U.S. Cl.
CPC ...
B23K 3/700 ; B23K 3/100 ; B23K 3/102 ;
Abstract
The invention provides a wire-bonding apparatus for forming electrical connections between a semiconductor chip and a leadframe, comprising a plurality of bond-heads associated with a plurality of work holders on said wire bonding apparatus for holding a plurality of leadframes, wherein each bond-head of the apparatus is capable of independent bonding operation simultaneously with the other bond-heads, without synchronization of movement with the other bond-heads.