The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2004
Filed:
Sep. 19, 2001
Koji Mishima, Fujisawa, JP;
Hiroaki Inoue, Tokyo, JP;
Natsuki Makino, Fujisawa, JP;
Junji Kunisawa, Yamato, JP;
Kenji Nakamura, Fujisawa, JP;
Tetsuo Matsuda, Yokohama, JP;
Hisashi Kaneko, Fujisawa, JP;
Toshiyuki Morita, Yokohama, JP;
Other;
Abstract
The present invention relates to a plating method and a plating apparatus which can attain embedding of copper into fine interconnection patterns with use of a plating liquid having high throwing power and leveling properties, and which can make film thickness of a plated film substantially equal between an interconnection region and a non-interconnection region. A plating method comprises filling a plating liquid containing metal ions and an additive into a plating space formed between a substrate and an anode disposed closely to the substrate so as to face the substrate, and changing concentration of the additive in the plating liquid filled into the plating space during a plating process.