The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2004

Filed:

Oct. 03, 2002
Applicant:
Inventors:

Chung-Ju Wu, Kaohsiung, TW;

Kuei-Chen Liang, Hsinchu, TW;

Wei-Feng Lin, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/302 ;
U.S. Cl.
CPC ...
H01L 2/302 ;
Abstract

An integrated circuit package capable of improving signal quality is disclosed. The integrated circuit package comprises a first substrate, an integrated circuit chip attached on the first surface of the first substrate. This integrated circuit package further comprises a plurality of external terminals mounted on the first substrate and a plurality of first bonding pads mounted on the edge portion of the first surface of the first substrate and respectively connected to the corresponding external terminals. Also, the integrated circuit package further comprises a second substrate and a plurality of second bonding pads mounted on the second surface of the second substrate and connected to the first bonding pads formed on the first substrate. Furthermore, this integrated circuit package further comprises a plurality of passive components disposed on the second substrate.


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