The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2004
Filed:
Apr. 16, 2002
Applicant:
Inventors:
Giles Humpston, San Jose, CA (US);
Yoshikatsu Ichimura, Tokyo, JP;
Nancy M. Mar, Mountain View, CA (US);
Daniel J. Miller, San Francisco, CA (US);
Michael J. Nystrom, San Jose, CA (US);
Gary R. Trott, San Mateo, CA (US);
Assignee:
Agilent Technologies, Inc., Palo Alto, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/102 ; B23K 1/00 ; B32B 3/100 ;
U.S. Cl.
CPC ...
B23K 3/102 ; B23K 1/00 ; B32B 3/100 ;
Abstract
Fluxless soldering processes use pressure variations and vented cavities within large-area solder joints to reduce void volumes and improve the properties of the large-area solder joints. The vents can be sealed after soldering if closed cavities are desired. A cavity can also improve hermeticity of a solder joint by providing an additional solder fillet around the cavity in addition to the solder fillet around the perimeter of the solder joint.