The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2004

Filed:

Nov. 13, 2001
Applicant:
Inventor:

Kang Rim Choi, Cupertino, CA (US);

Assignee:

IXYS Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/346 ; H01L 2/352 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/346 ; H01L 2/352 ; H01L 2/940 ;
Abstract

A radio frequency power device includes a substrate including a first conductive layer, a second dielectric layer, and a third conductive layer. The first conductive layer is bonded to the second dielectric layer, and the second dielectric layer is bonded to the third conductive layer. The first and third conductive layers are electrically isolated from each other. A semiconductor die is bonded to the first conductive layer of the substrate. A plastic package encloses and protects the semiconductor die. A plurality of leads extend outwardly from the plastic package. The leads have blade-like shapes.


Find Patent Forward Citations

Choi, Kang. (2004). High frequency power device with a plastic molded package and direct bonded substrate (U.S. Patent No. 6731002). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6731002

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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