The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2004
Filed:
Oct. 04, 2002
Applicant:
Inventors:
Hiroto Tokutome, Hyogo, JP;
Takuya Ariki, Hyogo, JP;
Assignee:
Renesas Technology Corp., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/334 ;
Abstract
A plurality of electrical wires are provided on a rear surface of a semiconductor module substrate having a structure that it is possible to mount a repair chip having a long lead and a repair chip having a normal lead in an overlaying manner and that it is possible to provide either repair chip or repair chip, which correspond to a plurality of bare chips, respectively. Thereby, it is possible to obtain a semiconductor module capable of repairing in a case where any bare chip becomes defective or even in a case where any combination of bare chips becomes defective.