The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6727581 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 27, 2004

Filed:

Sep. 13, 2002
Applicant:
Inventors:

Ryo Abe, Hyogo, JP;

Takayuki Miyamoto, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/334 ;
Abstract

In a case that a bare chip has been detected as being defective from among bare chips, a good chip is mounted to the rear surface of the surface wherein the bare chips are provided to a semiconductor module substrate so that a QFC pin of the bare chip is fixed at the ground potential (GND). Thereby, the bare chip stops the output of a signal to the input/output terminals or the input of a signal from the input/output terminals. As a result, the good chip outputs an electrical signal to the input/output terminals or an electrical signal is inputted from the input/output terminals. Thereby, a semiconductor module is gained that can be repaired even in the case that a defective chip is detected after the chip has been molded into a mold resin.


Find Patent Forward Citations

Abe, Ryo. (2004). Semiconductor module (U.S. Patent No. 6727581). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6727581

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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