The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2004
Filed:
Dec. 06, 2001
Applicant:
Inventors:
Takahiro Hashimoto, Fukushima, JP;
Kazutoshi Mizushima, Fukushima, JP;
Assignee:
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 ;
U.S. Cl.
CPC ...
B24B 1/00 ;
Abstract
Distribution of machining ability in periphery surface is grasped and evaluated through measuring the machined depth at several positions of the peripheral portion by use of a wafer for the evaluation of the ability of machining the peripheral portion thereof.
Hashimoto, Takahiro. (2004). Wafer for evaluating machinability of periphery of wafer and method for evaluating machinability of periphery of wafer (U.S. Patent No. 6722954). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6722954
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile