The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2004

Filed:

Sep. 25, 2001
Applicant:
Inventor:

Matthew Harris Lent, Livermore, CA (US);

Assignee:

KLA-Tencor Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/36 ;
U.S. Cl.
CPC ...
H05K 3/36 ;
Abstract

A process and apparatus is disclosed capable of removably adhering a semiconductor substrate to a substrate support in a sub-atmospheric environment using a plurality of individual fibers, each mounted at one end adjacent the substrate support, and each having a loose end. When the portions of the fiber adjacent the loose fiber ends are each brought into contact with the under surface of the substrate, Van der Waals forces are exerted between the substrate and the fibers to urge the substrate toward the underlying substrate support. In a preferred embodiment, the substrate and portions of the fiber adjacent the loose fiber ends are first vertically brought into physical contact with one another, and then a horizontal force is applied to horizontally move, with respect to one another, the substrate and the portions of the fibers adjacent the loose fiber ends. After application of the horizontal force, a vertical force is applied between the substrate and the fibers of sufficient strength to urge the substrate and the fibers away from one another without breaking contact between the substrate and the portions of the fiber adjacent the fiber ends to thereby place tension on the substrate to urge the substrate to lie flat against the underlying substrate support.


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