The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2004
Filed:
May. 17, 2000
Applicant:
Inventors:
Yuichi Iwakata, Warabi, JP;
Hayato Noguchi, Urawa, JP;
Katsuhisa Taguchi, Koshigaya, JP;
Kazuyoshi Ebe, Shiraoka-machi, JP;
Assignee:
Lintec Corporation, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/900 ; H01L 2/100 ;
U.S. Cl.
CPC ...
G06F 1/900 ; H01L 2/100 ;
Abstract
A method of processing a semiconductor wafer. The wafer is secured to a wafer supporting member having a data carrier. Information required for working the semiconductor wafer is input to the data carrier. The wafer is then worked according to information read from the data carrier. The data carrier is configured to permit operations such as back grinding, dicing and pickup of the wafer, and prevents wafer breakage when the wafer is carried between different operations.