The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2004
Filed:
Feb. 26, 2003
Jin-Hyuk Lee, Seoul, KR;
Sa-Yoon Kang, Seould, KR;
Dong-Whee Kwon, Kyungki-do, KR;
Ji-Yong You, Kyungki-do, KR;
Hye-Soo Shin, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor device for reinforcing a substructure of a bond pad and a method for fabricating the same are provided. According to an embodiment, a semiconductor device for reinforcing a substructure of a bond pad comprises a semiconductor substrate and a substructure formed on the semiconductor substrate. The semiconductor device further includes an interlevel dielectric layer formed on the substructure. The interlevel dielectric layer includes a contact opening formed therein. The contact opening comprises a plurality of separate dots connected to each other. A contact plug is formed in the contact opening.