The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2004

Filed:

Jun. 22, 2001
Applicant:
Inventors:

Michael R. Bruce, Austin, TX (US);

Glen P. Gilfeather, De Valle, TX (US);

Rama R. Goruganthu, Austin, TX (US);

Jiann Min Chin, Singapore, SG;

Shawn McBride, Austin, TX (US);

Assignee:

Advanced Mircor Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/100 ; H01L 2/184 ;
U.S. Cl.
CPC ...
H01L 2/100 ; H01L 2/184 ;
Abstract

An integrated circuit die having silicon on insulator (SOI) structure is analyzed in a manner that enhances the ability to detect photoemissions from the die. According to an example embodiment of the present invention, one of two or more lenses having a higher relative photon count is identified and used to analyze a semiconductor die. The die has at least a portion of the insulator of the SOI structure exposed, and photon emissions are detected using each lens via the exposed insulator in response to the die being stimulated. The number of photons detected using each lens is compared, and the lens having a higher photon count rate is identified, optimizing the photon count for the particular type of die preparation used to expose the insulator. The identified lens is then used with the high-speed detector to detect photoemissions from the die, and the detected photoemissions are used to analyze the die.


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