The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2004

Filed:

Mar. 20, 2003
Applicant:
Inventors:

Akio Machida, Kanagawa, JP;

Dharam Pal Gosain, Kanagawa, JP;

Setsuo Usui, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 5/140 ; H01L 2/100 ; H01L 2/120 ; H01L 2/131 ; H01L 2/701 ;
U.S. Cl.
CPC ...
H01L 5/140 ; H01L 2/100 ; H01L 2/120 ; H01L 2/131 ; H01L 2/701 ;
Abstract

A functional device free from cracking and having excellent functional characteristics, and a method of manufacturing the same are disclosed. A low-temperature softening layer ( ) and a heat-resistant layer ( ) are formed in this order on a substrate ( ) made of an organic material such as polyethylene terephthalate, and a functional layer ( ) made of polysilicon is formed thereon. The functional layer ( ) is formed by crystallizing an amorphous silicon layer, which is a precursor layer, with laser beam irradiation. When a laser beam is applied, heat is transmitted to the substrate ( ) and the substrate ( ) tends to expand. However, a stress caused by a difference in a thermal expansion coefficient between the substrate ( ) and the functional layer ( ) is absorbed by the low-temperature softening layer ( ), so that no cracks and peeling occurs in the functional layer ( ). The low-temperature softening layer ( ) is preferably made of a polymeric material containing an acrylic resin. By properly interposing a metal layer and a heat-resistant layer between the substrate ( ) and the functional layer ( ), a laser beam of higher intensity can be irradiated.


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