The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2004
Filed:
Feb. 13, 2001
Ibiden Co., Ltd., Gifu, JP;
Abstract
A printed circuit board and a method for manufacturing the same that facilitates the formation of an upper surface pattern and prevents a lower surface metal foil from being damaged when forming a blind via hole with a laser. A lower surface and an upper surface of an insulative substrate ( ) are respectively coated with a lower surface metal foil ( ) and an upper surface metal foil ( ), the thickness of which is less than that of the lower surface metal foil ( ). Next, an opening ( ) is formed in the upper surface metal foil at a location corresponding to a blind via hole formation portion ( ) of the insulative substrate. A blind via hole ( ), the bottom of which is the lower surface metal foil, is formed by emitting a laser ( ) against the blind via hole formation portion ( ) through the opening ( ). Then, a metal plating film ( ) is applied to the wall of the blind via hole ( ), and an upper surface pattern ( ) and a lower surface pattern ( ) are formed through etching.