The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2004
Filed:
Nov. 28, 2001
Henry Fang, Hsinchu, TW;
Chung-Hsin Chen, Hsinchu, TW;
Winbond Electronics Corporation, Hsinchu, TW;
Abstract
A dispatching method of manufacturing integrated circuit (IC) by push and pull two-way is to decide the dispatching orders of lots of wafers in each workstation. First, the priorities of lots of wafers is determined, and then the dispatching method of manufacturing IC by push and pull two-way is proceeded to run several push steps and pull steps. The push step is to dispatch wafers directly from upper process, no matter the lower units are crowded or delayed. On the other hand, the pull step is first to concern deficiencies in the lower unit, and then to dispatch wafers from the upper units. After proceeding the push steps and the pull steps, the other lots of wafers are dispatched by their original priorities. The dispatching method of manufacturing IC by push and pull two-way has the advantage of increasing the utilities of equipments.