The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6710439 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 23, 2004

Filed:

Sep. 12, 2002
Applicant:
Inventors:

Keun-hyuk Lee, Seoul, KR;

Gi-Young Jeun, Bucheon, KR;

O-seob Jeon, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/352 ;
U.S. Cl.
CPC ...
H01L 2/352 ;
Abstract

A power semiconductor module in which a main circuit terminal lead frame part and a control circuit lead frame part are bent toward a main circuit lead frame part, is provided. The power semiconductor module includes a main circuit part; a control circuit part and a control circuit terminal which are placed along a plane perpendicular to the main circuit part; a main circuit terminal placed along another plane perpendicular to the main circuit part, facing the control circuit part the control circuit terminal; a bonding wire; and a mold compound. Accordingly, it is possible to realize a light and compact intelligent power module that is simple to manufactured at a low cost.


Find Patent Forward Citations

Lee, Keun-hyuk. (2004). Three-dimensional power semiconductor module and method of manufacturing the same (U.S. Patent No. 6710439). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6710439

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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