The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2004
Filed:
May. 29, 2001
Naoki Komai, Kanagawa, JP;
Takeshi Nogami, Kanagawa, JP;
Hideyuki Kito, Kanagawa, JP;
Mitsuru Taguchi, Tokyo, JP;
Katsumi Ando, Tokyo, JP;
Sony Corporation, Tokyo, JP;
Abstract
A method of implementing an electrolytic polishing process against a wiring-material film by way of preventing excessive polishing or incomplete polishing caused by presence of differential steps locally generated in the objective wiring-material film. The inventive method comprises a step of forming a wiring-material film for burying recessed portions formed on an insulating film formed on a substrate via a plating process; a step of reducing a local differential step generated on the surface of the wiring-material film by way of preserving the wiring material film on the insulating film; and a final step of removing the wiring-material film deposited on the insulating film by way of preserving such wiring-material film deposited, solely inside of the recessed portions.