The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2004
Filed:
Oct. 02, 2002
Kuo-Chou Chen, Tainan, TW;
Huai-Jen Hsu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Hsin-Chu, TW;
Abstract
A process for forming a bond pad structure to be used to accommodate a subsequent wire bond, has been developed. The process features defining a bond pad opening in a composite insulator stack, exposing a portion of a top surface of an upper level metal interconnect structure at the bottom of the bond pad opening. The bond pad opening is formed with a top portion of the composite insulator stack laterally pulled back from a bottom portion of the same composite insulator stack. The bond pad structure, comprised of aluminum—copper, is then formed entirely in the bond pad opening, with the top surface of the bond pad structure lower than the top surface of the composite insulator stack, thus resulting in a bond pad structure topography offering reduced risk of damage during subsequent pre-wire bonding procedures.