The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6709322 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 23, 2004

Filed:

Mar. 29, 2001
Applicant:
Inventors:

Miguel Angel Saldana, Fremont, CA (US);

Damon Vincent Williams, Fremont, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 5/00 ;
U.S. Cl.
CPC ...
B24B 5/00 ;
Abstract

A CMP system and methods reduce a cause of differences between an edge profile of a chemical mechanical polished edge of a wafer and a center profile of a chemical mechanical polished central portion of the wafer within the edge. The wafer is mounted on a carrier surface of a wafer carrier so that a wafer axis of rotation is gimballed for universal movement relative to a spindle axis of rotation of a wafer spindle. A retainer ring limits wafer movement on the carrier surface perpendicular to the wafer axis. The retainer ring is mounted on and movable relative to the wafer carrier. A linear bearing is configured with a housing and a shaft so that a direction of permitted movement between the wafer carrier and the retainer ring is only movement parallel to the wafer axis, so that a wafer plane and a retainer ing may be co-planar.


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Saldana, Miguel. (2004). Apparatus for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing (U.S. Patent No. 6709322). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6709322

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