The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2004
Filed:
Mar. 12, 2003
Applicant:
Inventors:
Assignee:
Silicon Integrated Systems Corp., Hsin chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 ; H05K 1/18 ; H05K 7/02 ; H05K 7/06 ; H05K 7/08 ;
U.S. Cl.
CPC ...
H05K 1/00 ; H05K 1/18 ; H05K 7/02 ; H05K 7/06 ; H05K 7/08 ;
Abstract
A chip-packaging substrate and test method therefor. The chip-packaging substrate includes at least one package area and a connection area enclosed by and connected to the package areas. A test circuit is arranged within the connection area, passing through at least two wire layers and the insulation layer therebetween. The test circuit electrically connects the first electrodes. Failure of the chip-packaging substrate is detected when the test circuit is open between any two electrodes.