The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2004

Filed:

Dec. 29, 2000
Applicant:
Inventors:

Steven L. Pollock, Hillsboro, OR (US);

Robert L. Olivier, Forest Grove, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/352 ;
U.S. Cl.
CPC ...
H01L 2/352 ;
Abstract

An apparatus, comprising a substrate having a surface, comprising an array of electrical contacts, and a plurality of electrical planes, where the plurality of electrical planes are positioned within the electrical contact array.


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Pollock, Steven. (2004). Efficient multiple power and ground distribution of smt ic packages (U.S. Patent No. 6707145). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6707145

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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