The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2004
Filed:
Jul. 29, 2002
Applicant:
Inventors:
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/176 ;
U.S. Cl.
CPC ...
H01L 2/176 ;
Abstract
The spaces in chuck grooves and are evacuated to chuck the entire surface of a wafer to the chuck surface of a wafer support table and curve the wafer A wafer is horizontally opposed to the wafer and the center of the wafer is pressed by a press pin . The centers of the two wafers and are contacted, and the contact portion gradually spreads to the vicinity of the periphery of a central portion and takes a substantially circular shape. After that, the chuck by the chuck grooves is stopped. Consequently, the wafer flattens, and the entire surfaces of the wafers and are contacted.