The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2004

Filed:

Jul. 29, 2002
Applicant:
Inventors:

Toru Takisawa, Atsugi, JP;

Takao Yonehara, Atsugi, JP;

Kenji Yamagata, Sagamihara, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/176 ;
U.S. Cl.
CPC ...
H01L 2/176 ;
Abstract

The spaces in chuck grooves and are evacuated to chuck the entire surface of a wafer to the chuck surface of a wafer support table and curve the wafer A wafer is horizontally opposed to the wafer and the center of the wafer is pressed by a press pin . The centers of the two wafers and are contacted, and the contact portion gradually spreads to the vicinity of the periphery of a central portion and takes a substantially circular shape. After that, the chuck by the chuck grooves is stopped. Consequently, the wafer flattens, and the entire surfaces of the wafers and are contacted.


Find Patent Forward Citations

Takisawa, Toru. (2004). Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate fabrication method (U.S. Patent No. 6706618). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6706618

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…