The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2004

Filed:

Jan. 08, 2001
Applicant:
Inventors:

Tetsuzo Yoshimura, Tokyo, JP;

Yashuhito Takahashi, Nagano, JP;

Kiyoshi Kuwabara, Zama, JP;

Solomon I. Beilin, San Carlos, CA (US);

Michael Peters, Santa Clara, CA (US);

Wen-Chou Vincent Wang, Cupertino, CA (US);

Masaaki Inao, Machida, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/100 ;
U.S. Cl.
CPC ...
H01L 2/100 ;
Abstract

A method of constructing an electronic circuit assembly comprising forming at least one electrode on a substrate; forming a layer of undercladding material upon the substrate and over the electrode; and forming a wave guide core layer on the layer of cladding material. The wave guide layer is patterned to produce at least one optical wave guide and exposed undercladding material. The method of constructing further includes forming a layer of overcladding material upon the exposed undercladding material and over the optical wave guide; forming at least one via aperture through the overcladding material and the undercladding material; and disposing a conductive material in the via aperture to produce an electronic circuit assembly.


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