The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2004
Filed:
Dec. 14, 1999
Hideyuki Kurita, Kanuma, JP;
Masanao Watanabe, Kanuma, JP;
Sony Chemicals Corp., Tokyo, JP;
Abstract
A double-sided flexible printed circuit board is manufactured by the following steps of: (a) forming a polyimide precursor layer on a first metal layer; (b) forming a second metal layer on the polyimide precursor layer; (c) patterning the second metal layer to form a second circuit layer or (c′) patterning the first metal layer to form a first circuit layer; and (d) imidating the polyimide precursor layer to form a polyimide insulating layer. The polyimide precursor layer is obtained by dissolving a polyamic acid or other polyimide precursor in N-methyl-2-pyrrolidone or the like and applying the resultant varnish to the first metal layer. The polyimide layer is then dried. The imidation ratio of the dried polyimide precursor layer is prevented from exceeding 50%.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile