The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2004

Filed:

Feb. 14, 2002
Applicant:
Inventor:

Hsien-Kuang Chiu, Taoyuan, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/100 ;
U.S. Cl.
CPC ...
H01L 2/100 ;
Abstract

A method for automated monitoring and controlling of a semiconductor wafer plasma etching process including collecting data versus time during a plasma etching process the data including information representative of a concentration of at least one pair of reactant and product species present during the course of the plasma etching process; calculating a selected ratio of at least one reactant species and one product species at selected time intervals in the plasma etching process to create real-time concentration ratio data; retrieving model concentration ratio data for the at least one reactant species and one product species for comparison with the real-time concentration ratio data; comparing the model concentration ratio data with the real-time concentration ratio data to determine a difference; and, adjusting at least one plasma process operating parameter to minimize the difference.


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