The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2004
Filed:
Oct. 07, 2002
Hideki Matsuzawa, Nagano, JP;
Shintaro Hayashi, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A leadframe used for a leadless package (a semiconductor device) such as a quad flat non-leaded package (QFN) includes a die-pad portion disposed in a center of an opening defined by a frame portion, and a plurality of lead portions extending from the frame portion toward the die-pad portion in a comb shape. A lead width of a portion along a circumference of a region to be ultimately divided as a semiconductor device, of each of the lead portions, is formed narrower than that of the other portion of the corresponding lead portions. In the leadframe, a plurality of die-pad portions are disposed, the frame portion is provided so as to surround each of the die-pad portions, and a plurality of lead portions corresponding to each of the die-pad portions extend from the frame portion surrounding the corresponding die-pad portion toward the corresponding die-pad portion. Moreover, an adhesive tape is attached to one surface of the leadframe.