The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6700090 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 02, 2004

Filed:

Aug. 28, 2002
Applicant:
Inventors:

Tetsuo Ono, Iruma, JP;

Katsumi Setoguchi, Ome, JP;

Hideyuki Yamamoto, Kudamatsu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 9/00 ;
U.S. Cl.
CPC ...
B23K 9/00 ;
Abstract

Plasma is generated in a vacuum processing apparatus and a high-frequency voltage is applied to a lower electrode on which a wafer is placed. The high-frequency voltage applied to the lower electrode is subjected to periodical on-off modulation, the on-off duty ratio of which is determined for each wafer or each plurality of wafers, to carry out plasma processing on the wafer. As a result, in the plasma processing carried out on the wafer, the wafer is fabricated with a high degree of reproducibility by suppressing variations in fabricated-line dimension from wafer to wafer without decreasing the throughput.


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Ono, Tetsuo. (2004). Plasma processing method and plasma processing apparatus (U.S. Patent No. 6700090). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6700090

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