The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6690081 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 10, 2004

Filed:

Nov. 19, 2001
Applicant:
Inventors:

Muhannad S. Bakir, Atlanta, GA (US);

Hollie Reed, Atlanta, GA (US);

Paul Kohl, Atlanta, GA (US);

Chirag S. Patel, Peekskill, NY (US);

Kevin P. Martin, Atlanta, GA (US);

James Meindl, Marietta, GA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/900 ;
U.S. Cl.
CPC ...
H01L 2/900 ;
Abstract

Devices and method of fabrication thereof are disclosed. A representative device includes one or more lead packages. The lead packages include a substrate including a plurality of die pads, an overcoat polymer layer, a plurality of sacrificial polymer layers disposed between the substrate and the overcoat polymer layer, and a plurality of leads. Each lead is disposed upon the overcoat polymer layer having a first portion disposed upon a die pad. The sacrificial polymer layer can be removed to form one or more air-gaps.


Find Patent Forward Citations

Bakir, Muhannad. (2004). Compliant wafer-level packaging devices and methods of fabrication (U.S. Patent No. 6690081). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6690081

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…