The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2004
Filed:
Nov. 12, 2002
Applicant:
Inventors:
Seiki Sakuyama, Kawasaki, JP;
Masayuki Ochiai, Kawasaki, JP;
Ichiro Yamaguchi, Kawasaki, JP;
Joji Fujimori, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
Abstract
A method of making a semiconductor device includes a resin film forming step for forming a resin film on a semiconductor substrate provided with electrode portions to cover the electrode portions an opening forming step for forming openings in the resin film at locations corresponding to the electrode portions a loading step for loading a bump material in the openings, a bump forming step for forming bumps in the openings by heating, and a removing step for removing the resin film.