The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2004
Filed:
Aug. 13, 2001
Applicant:
Inventor:
Yung-Tsun Lo, Hsinchu Hsien, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 ;
U.S. Cl.
CPC ...
B24B 1/00 ;
Abstract
In a wafer surface protection method, a protective film is formed on a front surface of a wafer before the wafer performs a potentially wafer process. The protective film is a non-adhesive layer. An adhesive tape is adhered onto the protective film before conducting the polluting process. After the polluting process is completed, the adhesive tape is removed along with the protective film. As a result, no adhesive residues remain on the surface of the wafer.