The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2004
Filed:
Aug. 16, 2000
Applicant:
Inventors:
Chenting Lin, Poughkeepsie, NY (US);
Robert van den Berg, Hopewell Junction, NY (US);
Sumit Pandey, Wappingers Falls, NY (US);
Assignee:
Infineon Technologies AG, , DE;
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/1306 ;
U.S. Cl.
CPC ...
H01L 2/1306 ;
Abstract
Improved CMP uniformity is achieved by providing improved control of the slurry distribution. Improved slurry distribution is achieved by, for example, the use of a slurry dispenser that dispenses slurry from a plurality of dispensing points. Providing a squeeze bar between the slurry dispenser and wafer to redistribute the slurry also improves the slurry distribution.