The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2004
Filed:
Apr. 15, 2003
Applicant:
Inventors:
William G. McDonald, Scottsdale, AZ (US);
Michael Chapman, Gilbert, AZ (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ; H01L 2/312 ;
U.S. Cl.
CPC ...
H01L 2/3495 ; H01L 2/312 ;
Abstract
A semiconductor component includes a non-leaded leadframe ( ) having at least one interior electrical contact ( ) and a plurality of exterior electrical contacts ( ), a semiconductor chip ( ) mounted onto the leadframe, a mold compound ( ) disposed around the semiconductor chip, a cavity ( ) in the mold compound exposing a portion of the at least one interior electrical contact, an electronic chip ( ) mounted in the cavity, and a cover ( ) disposed over the cavity. In one embodiment, the leadframe is part of an array including a plurality of leadframes spaced apart from each other by a plurality of dam bars.